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Favorite Features Of An IC Package Designer: Assembly Rule Checks

Comments(0)Filed under: IC Package Physical layout and co-design, Digital SiP design, Analog and RF SiP design, IC Packaging & SiP design, wirebond profile library, Kulicke & Soffa, SPB, 3D-IC, SiP, SPB16.3, Allegro 16.3, IC Packaging and SiP, package

This is the third in a series of discussions we would like to open up regarding "favorite features" in an IC Packaging implementation design tool.

As the industry continues to include larger numbers of larger die in a smaller IC package, the question of "Can this be manufactured?" rings ever louder.  No one likes to have their artwork reviewed by the manufacturer and receive the news that things have to change.  It only has to happen once before the Assembly Rule Checks in Cadence IC Packaging tools becomes a favorite feature.

The objective of the Assembly Rule Checks is to go beyond what the design environment could provide in an online DRC environment.  As many of these checks look at the three-dimensional die stack, it was not practical to have this kind of checking occurring in real time.

Thanks to collaboration with some of the largest semiconductor companies in the world, the Cadence IC Packaging design tools have a rich set of batch oriented assembly rule checks that help tighten the loop between design and manufacturing.

As no package designer wants to be the cause of a delay in getting a design to volume manufacturing, we choose Assembly Rule Checks as a favorite feature in an IC Package design solution.

Please take six and one-half minutes of your time to watch the video below, and you will see why IC Package designers love the convenience of performing Assembly Rule Checks from the design environment.

If the video fails to play click here.

Let us know what Assembly Rule Checks help you get your products to volume manufacturing faster.



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