This is the second in a series of discussions we would like to open up regarding “favorite features” in an IC Packaging implementation design tool.
Recently on a visit to an avid user of IC Package design tools, we heard the requirement mantra of efficiency and flexibility. Many package designers are seeing their designs become more and more complex with little to no additional time in the schedule. This means they need to use whatever tricks they can to get the job done efficiently. And their tool suppliers are being pressed to make design tasks simpler and more automated.
In the spirit of getting jobs done efficiently, we have seen a growing trend in needing to bring different data formats into the Cadence Allegro package design environment. We believe this is largely due to simpler design environments not having the required power. As an example, many leadframe designs are imported through an “intelligent” .dxf file (AutoCAD format), and sophisticated wirebonding implementation and signal and power integrity analyses is then performed in the Cadence environment.
The open architecture of the Cadence SiP and Allegro Package Design environments essentially gives users the ability to get almost any data format in as well as export to a set of common manufacturing formats.
As there are many customers that live and breathe based on the ability to be efficient and flexible, we choose a rich and diverse set of import and export file formats as a favorite feature in an IC Package design solution.
Give us six more minutes of your time, watch the video below, and you will see why IC Package designers love the flexibility and efficiency of working with multiple file formats.
If the video fails to play click here.
Let us know what import / export file formats make your life easier when designing IC Packages.