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APD and SiP Layout 16.3 - Virtual-ly Amazing

By Brad Griffin on December 4, 2009Comments(0)Filed under: Digital SiP design, 3D-IC, APD, SPB16.3, Allegro 16.3, CAO16.3, IC Packaging and SiP

On December 2, the Cadence Allegro team went live with the Cadence Allegro and OrCAD 16.3 Virtual Conference (CAO16.3).

 

Main Hall

 

This virtual first in EDA was an amazing success with hundreds of visitors, many of whom visited the SiP and IC Packaging booth.

 

SiP Booth

 

If you missed this event as it was happening, do not be concerned.  You can still register and check out the content in the booth.  You will want to pay special attention to the newest product in the SiP and IC Packaging space, Cadence SiP Layout XL.  Video demonstrations and papers are at your fingertips!

 

SiP Booth Content

 

I think you will also enjoy the presentations from our sponsors.  Once you've had a chance to look around, let me know what you think of EDA's first Virtual Conference.

 

Brad Griffin

 

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