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Everything You Want to Know About APD / SiP 16.2 - Bill Acito Webinar on March 18

Comments(1)Filed under: IC Packaging & SiP design, 16.2, SiP, webinar, HDI, APD

(Note: Click here to view Bill Acito's webinar.)


If you caught Jerry GenPart's blog in November on Advanced Plating Bar Checks and wondered what else is new in APD 16.2, you are in luck.  On Wed, March 18, Bill Acito, Product Engineer, will review the long list of new technology available in the latest release.

As an example, you'll see how the latest HDI technology in the Allegro platform is supported in APD / SiP.


 New HDI Via visualization 2D and 3D


And also the wirebond enhancements.


Multiple tiers of wirebond connections in 3D


Please join us for the webinar.  To register to see it live or view an archived recording (after March 18), please click here and choose the What's New in IC Packaging / SiP webinar.


We look forward to your feedback on this foray through the latest and greatest APD features.



By Akshatha on October 25, 2010
Im new to package designing,I have a query.
After adding tackpoints,i cant add bond fingers & viceversa.Since the pattern style list oxes are disabled.Could you please help me out to resolve.

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