Home > Community > Blogs > PCB Design > power integrity solution spans multiple pcbs and packages
 
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.

Register | Membership benefits
Get email delivery of the PCB Design blog (individual posts).
 

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

Power Integrity Solution Spans Multiple PCBs and Packages

Comments(0)Filed under: PCB design, Allegro PCB Editor, Allegro, PCB, Power Delivery Network, power integrity, Sigrity, electronics design, PowerDC, IR Drop analysis, thermal analysis, electrical thermal co-simulation

When designing next-generation products, the common theme is "faster, smaller, cheaper".  When that is combined with longer battery life and lower power consumption requirements, the design challenges can be daunting.  And one thing you know for sure, the project schedule is not going to be extended to allow you to overcome all these challenges.

It certainly makes sense that every electronic product designer has a tool that enables analysis of the power delivery network.  While components can tolerate certain fluctuations in power and ground rails, there are limits to that tolerance.  Having planes that are so heavily perforated that they look like Swiss cheese and scraping away at fill areas to make room for signal routing are only going to exasperate the voltage fluctuations.  But when you're under the pressures of "faster, smaller, cheaper", these are the compromises that need to be evaluated.

DC power analysis, also known as IR drop analysis, is commonly the first tool electronic product designers will turn to when facing these challenges.  However, one common complaint has been that the analysis is done at a static temperature.   With the current returning through perforated planes and choke areas (neck down areas) in the plane, the current density and, therefore, temperature, are going to be higher than in other portions of the PCB where these conditions do not exist. So, analyzing IR drop at a static ambient temperature can lead to inaccurate IR drop predictions.  Fortunately, there is a new trend, led by Cadence Sigrity PowerDC, where IR drop analysis is done concurrently with thermal analysis.  This allows the tool to predict the correct DC voltage drop based on the operating temperature of that region of the electronic product's PCB.  In addition to electrical-thermal co-simulation, Sigrity PowerDC is now capable of analyzing multi-board configurations.  So products that have memory cards attached can have the full system power delivery network analyzed.

If this sounds like something you would be interested in learning more about, please watch the 11-minute demonstration video below.

We hope you found the demonstration informative. Sigrity PowerDC has been addressing complex power integrity problems for years, and continues to advance as a member of the Cadence Allegro Sigrity Integration (ASI) 16.6.1 product release.

Please do tell us about your experiences with PowerDC.

Team Allegro

 

Related stories:

Simultaneous Switching Noise Analysis - The Earlier the Better

Allegro Sigrity Makes its Debut at DesignCon 2013

Why Cadence Bought Sigrity - And How it May Change PCB Analysis

Comments(0)

Leave a Comment


Name
E-mail (will not be published)
Comment
 I have read and agree to the Terms of use and Community Guidelines.
Community Guidelines
The Cadence Design Communities support Cadence users and technologists interacting to exchange ideas, news, technical information, and best practices to solve problems and get the most from Cadence technology. The community is open to everyone, and to provide the most value, we require participants to follow our Community Guidelines that facilitate a quality exchange of ideas and information. By accessing, contributing, using or downloading any materials from the site, you agree to be bound by the full Community Guidelines.