The MemCon 2013 conference, held August 6 in Santa Clara, California, provided a comprehensive overview of the past, present, and future of semiconductor memory technology. Nearly 500 attendees came to hear three keynote speeches, an expert panel, and three tracks of technical sessions. Whether you attended or not, you can now download presentations from the MemCon proceedings web page.
Presentations are available for the following events:
Memory: A Key System Optimization Challenge—Martin Lund, Cadence
Hybrid Memory Cube: Your New Standard for Memory Performance—Mike Black, Micron
New Directions in Memory Architecture—Bob Brennan, Samsung
Wider vs. Faster—Jim Handy, Objective Analysis, moderates a panel session including Shafy Eltoukhy (Open-Silicon), Becky Loop (Intel), Bill Gervasi (Discobolus Designs), and Gopal Raghavan (Cadence).
MemCon Track 1—DRAM
Successful Probing of DDR4 and LPDDRR3/4 for Functional Validation and Debug—Jennie Grosslight, Agilent
LPDDR4: Evolution for a New Mobile World—JY Choi, Samsung
Tuning DDR4 for Power and Performance—Mike Micheletti, Teledyne LeCroy
SoC Memory Interfaces, Today and Tomorrow at TSMC—Lilius Paris, TSMC
MemCon Track 2—Memory Subsystems
Test Implications for SoC Designs Utilizing LPDDR—Prashanth Thota, Tektronix
Embedded Resistors for High Performance Memory Solutions—Bill Gervasi, Discobolos Designs
Flash Storage Solutions for Embedded Applications—Making the Right Choice—Victor Tsai, SMART Modular Technologies.
Designing for DDR4—Power and Performance—Trung Tran, Altera
MemCon Track 3—Emerging Technologies
Memory Scaling: A Systems Architecture Perspective—Onur Mutlu, Carnegie Mellon University
Applications and Advantages of Low Power ReRAM—Lee Cleveland, 4DS
High Performance Memory Opportunities in 2.5D Network Flow Processors—Jay Seaton, Netronome
True 3D Memory Architecture Yields Amazing Performance—David Chapman, Tezzaron Semiconductor
Again, you can access these presentations at the MemCon 2013 proceedings web page. No registration is required.
Cadence Blogs About MemCon 2013
Wide I/O 2, Hybrid Memory Cube (HMC) - Memory Models Advance 3D-IC Standards
Semiconductor Memory Challenges Will be Overcome, MemCon Keynoter Says
Scaling the Semiconductor Memory Wall
MemCon Samsung Keynote: New DRAM and Flash Memory Architectures are Needed
MemCon Panel: Promises and Perils of 3D-IC Memory Standards