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DAC EDA360 Theater -- 30+ Customer, Partner Presentations and Recordings Available

Comments(0)Filed under: DAC, Design Automation Conference, EDA360 Theater, DAC 2012, Cadence customers, Cadence partners

At the recent Design Automation Conference (DAC 2012), Cadence customers and partners gave over 40 presentations at the EDA360 Theater in the Cadence booth. These half-hour presentations were full of good, "how we did it" technical information for chip and system designers, and not surprisingly, they drew attentive audiences. Topics included virtual prototypes, low power, mixed-signal, silicon-package-board, functional verification, advanced node digital design, SoC integration, custom IC design, and much more.

Cadence EDA360 Theater at DAC 2012

You can now listen to audio recordings and view the slides for most of the presentations that were given in the EDA360 Theater. A complete listing is available at the Cadence DAC 2012 web site. Below is a list of available presentations as of July 1, with direct links to the presentations. Happy listening!

Presentations from Monday, June 4

Extension Media - ASIC/ASSP Prototyping with FPGAs

Methods2Business -  Virtual Prototyping Plus Formally Proven Model Driven Software Generation

Marvell -  Accelerating Advanced Low Power Implementation Using Common Power Format

Xilinx - Specman Random Generation Solution for Design Attributes

Intel -  High Performance Simulation and Emulation Solution with Specman "e"

TowerJazz - Analog-Mixed Signal Power Management IC Reference Flow 2.0

Rohde & Schwarz -- LTE-Advanced - Taking LTE to True 4G

Bayside Design - Silicon-Package-Board Co-Design and Co-Analysis for a High Performance Multicore Chip

Fujitsu Semiconductor - Cadence Chip Planning Solution for Low-Cost MCU

Xilinx -- Extensible Virtual Platform for the Xilinx Zynq-7000 EPP

Presentations from Tuesday, June 5

Oski Technologies --  Build Your Own Formal "Apps"

SMIC -  SMIC Overview and Collaboration with Cadence

Cadence -- No Spin Zone: Solid State Drives Rock Storage Interfaces

Duolog -- Controlling the Cost of SoC Integration

LSI -- Combining Virtual Platforms, Emulation, and Hardware Prototypes

Fujitsu Semiconductor --  DvD analysis for MCU with on-chip LDO

Xilinx -- Zynq-7000 Extensible Processing Platform From RTL to Success With Emulation

STMicroelectronics - Integration of Enterprise Manager with an SQL Database in Verification Cockpit

AMD -- Using In-Circuit Acceleration

STMicroelectronics  --  A Metric-Driven Verification Approach for Analog/Mixed-Signal IP

Presentations from Wednesday, June 6

STMicroelectronics -  Analog Design Intent Capturing

Cadence --  Cadence Design IP for NVM Express

Cadence -  Verification IP

Imperas -  OS Porting and Analysis for ARM Cortex-A9 MPCore Based Systems

GLOBALFOUNDRIES - Beyond 28nm: New Frontiers and Innovations in Design for Manufacturability

Broadcom -- Using the Cadence Codesign Solution at Broadcom to Optimize System Interconnect Paths

PTC -- Next Gen MCAD-ECAD Co-Design

LeCroy - Ubiquitous PCI Express Verification from Simulation Through Post-Silicon Development

Dini Group - FPGA Based Prototyping: Make vs Buy

STMicroelectronics --  ST 20nm Constraint Driven Modgen Flow

Orora - Virtuoso Empowered by Automated Behavioral Modeling

GLOBALFOUNDRIES -- Creating Exceptional PDKs Through True Collaboration

NextOp Software --  Assertion Synthesis Apps for Simulation, Formal and Emulation

Richard Goering

 

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