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EDA Standards Review and Forecast, Part 2 – OSCI and Si2

Comments(0)Filed under: Industry Insights, SystemC, low power, OSCI, Si2, CPF, OpenAccess, AMS, OpenPDK, Silicon Integration Initiative, SystemC-AMS, CCI, OpenDFM

My last blog post provided a 2010 review and 2011 forecast for Accellera and IEEE EDA-related standards. This post looks at activity from the Open SystemC Initiative (OSCI) and Silicon Integration Initiative (Si2).

Perhaps the most "newsworthy" item on this list is the 2010 emergence of the OpenPDK standard, which seeks to establish a single data source that EDA vendors can compile into their unique process design kits. The effort was launched in May by Si2 and ten founding members, including Cadence, Mentor Graphics, and Synopsys. For more detail on OpenPDK, see my recent blog post.

Open SystemC Initiative

OSCI has a nice summary of recent activity in all its working groups here. I'll update two active efforts below and note what's expected in 2011.

Analog/Mixed Signal - The AMS working group is responsible for standardizing SystemC AMS extensions. 2010: Released AMS 1.0 standard in March. 2011: Whitepaper will discuss advanced capabilities for SystemC AMS extensions; public event is planned around European industry adoption of SystemC AMS.

Configuration, Control and Inspection - OSCI's newest working group focuses on the interoperability between models and tools. 2010: Requirements specification offered for public review, and initial standard defined. 2011: Group is developing LRM and examples, and will publish a draft standard for public review once LRM is complete.

Silicon Integration Initiative

Below are four key Si2 standards efforts. Cadence is actively participating in these coalitions, along with other EDA providers and user companies.

Low Power Coalition - This coalition is responsible for the Common Power Format (CPF) that was originally created by, and later donated by, Cadence. It has also published a low-power reference flow and is working on power modeling requirements. 2010: Released Interoperability Guide to support interoperability between CPF and Unified Power Format (UPF). Completed work on CPF 2.0. Released power model requirements for non-mutex and atomic modeling. 2011: Release CPF 2.0 as an open standard with a parser to ease adoption; the new revision improves power format interoperability and addresses new low-power design techniques and requirements. Release power modeling for variability.

OpenAccess Coalition - This coalition oversees the OpenAccess database and API. (As I noted in a recent blog post, the OpenAccess reference implementation is maintained and revised by a team at Cadence). 2010: Initial support for multi-threading was released at the end of the year, along with native support for 32nm constraints. 2011: Plans call for production release of scripting language bindings, as well as enhancements including scratch designs, partial loads, and advanced node support.

OpenDFM Coalition - This group is developing standards for interoperable design for manufacturability (DFM) flows. 2010: OpenDFM 1.0 was released as an open Si2 standard. 2011: OpenDFM 1.1 will add targeting and edge operations, and the coalition will define an XML data structure to hold the parameters needed for device and parasitic parameters.

OpenPDK Coalition - As noted above, this is a new standards effort aimed at simplifying the development of PDKs. 2010: Founding members established coalition and its working groups and posted requirements for technology (RFT) documents. 2011: Coalition plans to publish roadmap and release standards for process specifications, symbols, CDFs, and callbacks.

Get Involved!

The standards described in this two-part blog series, and no doubt others, will have a major impact on electronic design in 2011 and beyond. Building a standards-based ecosystem will require broad co-operation across the entire industry. Cadence is committed to this task, and we invite partners, competitors, and customers to participate in the many EDA standards efforts that are reshaping our industry.

Richard Goering

 

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