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CDN Live! Silicon Valley -- A Video Invitation From Cadence CMO John Bruggeman

Comments(0)Filed under: Industry Insights, Digital implemntation, Custom IC, RF Design, Functional Verification, Logic Design, CDNLive! Silcon Valley, PCB Design, IC Packaging and System-in-Package, System Design and verification

CDNLive! Silicon Valley, the largest of the CDNLive! Cadence user conferences, will be open for worldwide participation in 2009. This year’s conference is a webinar-based event that allows on-line participation as well as on-site attendance at Cadence’s San Jose, California headquarters. CDNLive! Silicon Valley runs two weeks – Oct. 5-9 and Oct. 12-16 – with on-site attendance available throughout the first week.

Why attend CDNLive! Silicon Valley? In the attached video clip, John Bruggeman, Cadence Chief Marketing Officer, explains how the conference can benefit you and your company.


If video fails to launch click here.

This year’s conference includes a technical program of over 60 webinars given by Cadence representatives, partners, and customers. Both on-site and remote attendees can discover best practices for boosting design productivity, get a closer look at Cadence products and solutions, and find out how peers are differentiating their designs and staying ahead of the competition. Those who attend live in San Jose can also network with their peers and exchange ideas in person, as well as attend hands-on workshops in custom design, functional verification, and digital implementation.

The first week, Oct. 5-9, offers tracks including Custom IC, PCB Design, IC Packaging and System-in-Package, RF Design, Logic Design, System Design and Verification, Functional Verification, and Digital Implementation. This week includes presentations from customers such as AMD, Cisco, Hitachi, IDT, Marvell, Micron, National Semiconductor, and Texas Instruments, as well as partners including ARM, CoWare, and Virtutech.

The second week, Oct. 12-16, is available on-line, although several presentations Monday and Tuesday can also be attended on site. Tracks include Custom IC, Digital Implementation, Functional Verification, Manufacturing Signoff, PCB Design, Logic Design, and System Design and Verification. This week includes presentations from Avago, Broadcom, Chelsio Communications, Freescale, Galazar, Hewlett-Packard, KMET Electronics, LSI, IBM, National Semiconductor, PMC-Sierra, RF Silicon, and Texas Instruments.

A detailed agenda is available on line. Registration is open until 5 pm Pacific time Wednesday, Sept. 30.

Richard Goering

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