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Embedded World 2014: The Design Challenges Ahead

Comments(0)Filed under: Cadence, design automation, Sigrity, ip cores, embedded design, IP design, automotive electronics, Allegro, automotive, Embedded World 2014

NUREMBERG, GERMANY--It is, in the electronics world, a singular show in a singular place. Embedded World combines scores of companies with a broad range of electronics technologies and thousands of engineers from around the world. Why Germany? Because the Germans have a passion for face-to-face technology exhibitions (witness, too, the biennial Electronica down the road in Munich).

Cadence EMEA as well as some executives from Cadence North America converged here this week to engage with customers and talk technology, everything from design and verification IP to PCB and IC packaging technology to hardware and software verification strategies and solutions.

And, this being Germany, there was a lot of focus on automotive electronics design, which has seen an explosion in hardware and software complexity in recent years.

Christian Malter, Cadence Director of Technology Solutions, Sales & Business Development EMEA, helped set the stage by describing the challenges facing automotive design engineers in an era of quickening system complexity: 

Carsten Elgert, Cadence Director of Product Marketing for IP based in Munich, talked about the importance of design IP and associated methodologies for increasingly complex automotive electronics designs:

Also at the Cadence booth in Hall 4, Srdjan Djordjevic, senior sales technical leader, talked with me about Cadence Allegro Sigrity PCB and IC Packaging tools advantages: 

All this came against the backdrop of the most passionate car culture in the world: Germany. Take a look at how Embedded World 2014 reflected that obsession: 


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